The University of Southampton

menglong Li

Postgraduate research student


Li, Menglong, Tudor, John and Beeby, Stephen (2017) Stress analysis of flexible packaging for the integration of electronic components within woven textiles. In Proceedings - Electronic Components and Technology Conference. (doi:10.1109/ECTC.2017.23).

Li, Menglong, Tudor, Michael, Torah, Russel and Beeby, Stephen (2017) Stress analysis and optimization of a Flip chip on flex electronic packaging method for functional electronic textiles. IEEE Transactions on Components Packaging and Manufacturing Technology. (doi:10.1109/TCPMT.2017.2780626).

Li, Menglong, Tudor, Michael, Liu, Jingqi, Komolafe, Abiodun, Torah, Russel and Beeby, Stephen (2018) The thickness and material optimization of flexible electronic packaging for functional electronic textile. Design, Test, Integration & Packaging of MEMS/MOEMS, Rome, Italy. 22 - 25 May 2018. 6 pp. (In Press)


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