Li, Menglong, Tudor, John and Beeby, Stephen (2017) Stress analysis of flexible packaging for the integration of electronic components within woven textiles. In Proceedings - Electronic Components and Technology Conference. (doi:10.1109/ECTC.2017.23).
Li, Menglong, Tudor, Michael, Torah, Russel and Beeby, Stephen (2017) Stress analysis and optimization of a Flip chip on flex electronic packaging method for functional electronic textiles. IEEE Transactions on Components Packaging and Manufacturing Technology. (doi:10.1109/TCPMT.2017.2780626).
Li, Menglong, Tudor, Michael, Liu, Jingqi, Komolafe, Abiodun, Torah, Russel and Beeby, Stephen (2018) The thickness and material optimization of flexible electronic packaging for functional electronic textile. Design, Test, Integration & Packaging of MEMS/MOEMS, Rome, Italy. 22 - 25 May 2018. 6 pp. (In Press)