The University of Southampton

Dr Terrence Mak, SMIEEE, PhD, DIC

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Dr. Terrence Mak is an Associate Professor at Electronics and Computer Science, University of Southampton, England. He has graduated from the Department of EEE at Imperial College. Supported by the Royal Society, he was a Visiting Scientist at MIT during 2010, and also affiliated with the Chinese Academy of Sciences as a Visiting Professor since 2013. Previously, He worked with Professor Ivan Sutherland, who was awarded the Turing Award, at Sun Laboratories in California and he has awarded and become the Croucher Foundation scholar and IEEE Senior Member. 

He asked the question "Why and How to design the inter-connections between silicons, wires, chips and systems?", which leads to significant contributions in the area of on-chip interconnects optimisation and adaptation (both many-core and FPGA), network-on-chips and interconnections in 3D-IC.

Throughout a spectrum of novelty and development, it led to prestigious Best Paper Awards at DATE 2011, IEEE/ACM VLSI-SoC 2014, IEEE PDP 2015, and IEEE EUC 2016. More recently, his newly published journal based on 3D adaptation has awarded the prestigious 2015 IET Computers & Digital Techniques Premium Award. He has published more than 120 papers in both conferences and top journals, and jointly published 4 books.  



Research interests

Interconnect is natural and has become a crucial component for almost everything and everywhere in this world, such as connections between people, between tube stations, between our organs and between the neurons in our brain. The basic formation of computer are two elements, silicon and interconnection. I am keen to think and look into interconnects, and keep asking myself - why do we need it? What is the foundation of interconnect can provide? How to design it and how to improve it? Also, how to provide connections between silicon and life? These are the questions always surrounding in my brain.



1. EPSRC iCase support for a PhD student to together with Arm – Wireless interconnects between layers of silicon (2016-2019)

2. Co-investigator for the project POET - Partially Ordered Event-Triggered Systems (2016-2021)

3. Co-investigator for the project KTP - AccelerComm and University of Southampton (2018-2021)


Dehir, Nizar, Mak, Terrence, Fei, Xia and Alex, Yakovlev (2014) Modeling and tools for power supply variations analysis in networks-on-chip. IEEE Transactions on Computers, 63 (3), 679-690. (doi:10.1109/TC.2012.272).

Tarawneh, Gareth, Yakovlev, Alex and Mak, Terrence (2014) Eliminating synchronization latency using sequenced latching. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 22 (2), 408-419. (doi:10.1109/TVLSI.2013.2243177).

Dahir, Nizar, Al-Dujaily, Ra'ed, Mak, Terrence and Yakovlev, Alex (2014) Thermal optimization in network-on-chip-based 3D chip multiprocessors using dynamic programming networks. [in special issue: Real-Time and Embedded Technology and Applications, Domain-Specific Multicore Computing, Cross-Layer Dependable Embedded Systems, and Application of Concurrency to System Design (ACSD'13)] ACM Transactions on Embedded Computing Systems, 13 (4s), 1-25. (doi:10.1145/2584668).

AL-DUJAILY, RAAED, Li, An, Maunder, Robert, Mak, Terrence, Al-Hashimi, Bashir and Hanzo, Lajos (2016) A Scalable Turbo Decoding Algorithm for High-Throughput Network-on-Chip Implementation. University of Southampton [Dataset]

Karkar, Ammar, Mak, Terrence, Tong, Kin-Fai and Yakolev, Alex (2016) A survey of emerging interconnects for on-chip efficient multicast and broadcast in many-cores. IEEE Circuits and Systems Magazine, 16 (1), 58-72.

Opoku Agyeman, M., Vien, Q., Yakovlev, A., Tong, K. and Mak, T. (2017) A resilient 2-D waveguide communication fabric for hybrid wired-wireless NoC design. IEEE Transactions on Parallel and Distributed Systems, 1-14. (doi:10.1109/TPDS.2016.2575836).

Karkar, A., Mak, T., Tong, K. and Yakovlev, A. (2016) Network-on-chip multicast architectures using hybrid wire and surface-wave interconnects. IEEE Transaction on Emerging Topics in Computing, 1-12. (doi:10.1109/TETC.2016.2551043).

Ng, J., Singh, A., Wang, X. and Mak, T. (2016) Defragmentation for efficient runtime resource management in NoC-based many-core systems. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 24 (11), 3359-3372. (doi:10.1109/TVLSI.2016.2548564).

Wang, X., Zhao, B., Wang, L., Mak, T., Yang, M. and Daneshtalab, M. (2016) A pareto-optimal runtime power budgeting scheme for many-core systems. Microprocessors and Microsystems, 46, part B, 136-148.

Fei, T., Wang, X., Zhang, B. and Mak, T. (2016) On runtime adaptive tile defragmentation for resource management in many-core systems. Microprocessors and Microsystems, 46, part B, 161-174. (doi:10.1016/j.micpro.2016.02.004).

Wang, X., Zhao, B., Mak, T., Yang, M., Jiang, Y. and Daneshtalab, M. (2016) On fine-grained runtime power budgeting for networks-on-chip systems. IEEE Transactions on Computers, 65 (9), 2780-2793.

Liu, Q., Ji, W., Chen, Q. and Mak, T. (2016) IP protection of mesh NoCs using square spiral routing. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 24 (4), 1560-1573.

Agyeman, M., Tong, K. and Mak, T. (2015) An improved wireless communication fabric for emerging Network-on-Chip design. [in special issue: The 10th International Conference on Future Networks and Communications (FNC 2015) / The 12th International Conference on Mobile Systems and Pervasive Computing (MobiSPC 2015) Affiliated Workshops] Procedia Computer Science, 56, 415-420.

Yi, W., Lo, K., Mak, T., Leung, K., Leung, Y. and Meng, H. (2015) A survey of wireless sensor network based air pollution monitoring systems. Sensors, 15 (12), 31392-31427.

Wang, X., Zhao, B., Mak, T., Yang, M. and Daneshtalab, M. (2015) An efficient runtime power allocation scheme for many-core systems inspired from auction theory. Integration the VLSI Journal, 50, 147-157. (doi:10.1016/j.vlsi.2014.11.001).

Luo, R., Coapes, G., Mak, T., Tadashi, Y., Degena, P. and Tin, C. (2016) Real-time simulation of passage-of-time encoding in cerebellum using a scalable FPGA-based system. IEEE Transactions on Biomedical Circuits and Systems, 10 (3), 742-753. (doi:10.1109/TBCAS.2015.2460232). (PMID:26452290)

Al-Dujaily, Ra'ed, Li, An, Maunder, Robert G, Mak, Terrence, Al-Hashimi, Bashir M. and Hanzo, Lajos (2016) A scalable turbo decoding algorithm for high-throughput network-on-chip implementation. IEEE Access, 1-1. (doi:10.1109/ACCESS.2016.2628801).

Wang, Xiaohang, Singh, Amit, Li, Bing, Yang, Yang, Li, Hong and Mak, Terrence (2018) Bubble budgeting: throughput optimization for dynamic workloads by exploiting dark cores in many core systems. IEEE Transactions on Computers, 67 (2), 178-192. (doi:10.1109/TC.2017.2735967).

Fletcher, Benjamin, James, Das, Shidhartha and Mak, Terrence (2017) Dataset supporting the paper entitled “A High-Speed Design Methodology for Inductive Coupling Links in 3D-ICs”. University of Southampton doi:10.5258/SOTON/D0312 [Dataset]

Fletcher, Benjamin, James, Das, Shidhartha, Poon, Chi-Sang and Mak, Terrence (2017) Dataset supporting the paper entitled “Low-Power 3D Integration using Inductive Coupling Links for Neurotechnology Applications". University of Southampton doi:10.5258/SOTON/D0318 [Dataset]

Wang, Ling and Mak, Terrence (2018) A Fault-Tolerant Routing Algorithm Using Tunnels in Fault Blocks for Network-on-Chip. Journal of Circuits, Systems and Computers, 27 (2). (doi:10.1142/S0218126618500226).

Fletcher, Benjamin James, Das, Shidhartha and Mak, Terrence (2017) A high-speed design methodology for inductive coupling links in 3D-ICs. Design Automation and Test in Europe, Dresden, Germany. 19 - 23 Mar 2018. 6 pp. (In Press)

Fletcher, Benjamin James, Das, Shidhartha, Poon, Chi-Sang and Mak, Terrence (2018) Low-power 3D integration using inductive coupling links for neurotechnology applications. Design Automation and Test in Europe, Dresden, Germany. 19 - 23 Mar 2018. 6 pp.

Wang, Liang, Wang, Xiaohang, Leung, Ho Fung and Mak, Terrence (2018) Runtime task mapping for lifetime budgeting in many-core systems. In FDL 2017 - Proceedings of the 2017 Forum on Specification and Design Languages. vol. 2017-September, IEEE Computer Society. 8 pp, pp. 1-8. (doi:10.1109/FDL.2017.8303900).

Mak, Terrence (2018) Special session on bringing cores closer together: the wireless revolution in on-chip communication. In Proceedings - 2018 IEEE 36th VLSI Test Symposium, VTS 2018. vol. 2018-April, IEEE Computer Society Press. 1 pp, p. 1. (doi:10.1109/VTS.2018.8368638).

Fletcher, Benjamin J., Das, Shidhartha and Mak, Terrence (2018) A high-speed design methodology for inductive coupling links in 3D-ICs. In Proceedings of the 2018 Design, Automation and Test in Europe Conference and Exhibition, DATE 2018. vol. 2018-January, Institute of Electrical and Electronics Engineers Inc. 6 pp, pp. 497-502. (doi:10.23919/DATE.2018.8342059).


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